Les conférences Design Würth Elektronik maintenant accessibles en ligne!

Nouvelles tendances technologiques pour les circuits imprimés. Restez au courant en participants aux conférences en ligne de Würth Elektronik !

Nous vous proposons des séminaires internet en complément de nos conférences design. Nos spécialistes et product manager vont vous éclairer quant aux nouvelles technologies PCB. Ils vont vous expliquer l’utilisation des technologies, vous présenter des applications, vous expliquer les règles de design, vous donner des conseils de design et bien plus. Saisissez l’opportunité de vous informer grâce à une présentation succincte, flexible et interactive.

Les Webinaires vont avoir lieu à 11h (CET).

Pour toute question, contactez-nous par courriel webinar@we-online.de.

Attention: Nos webinaires sont dispensés en anglais.

Our next Online Design Conferences at a glance

Please make a note of our next webinars:

  • 07.05.2019: Via Filling - Applications in practice

May 7th, 2019, 11:00 a.m. CET

Via Filling - Applications in practice

Speaker: Stefan Keller

Via filling or not? If so, how? These and other questions arise again and again during layouting. In the context of miniaturization, via treatment is becoming increasingly important. In PCB manufacturing there are different technologies used to treat vias.

In this webinar we will have a look at:

  • Filled & Capped Vias (Type 7 / IPC-4761)
  • Alternatives, also in connection with heat dissipation
  • Plugging
  • Microvia filling
  • Stacked Vias (IPC-2226A and others)

We also regard the reliability and cost aspects in each case.

Sign up to this webinar here!

Stefan Keller

Stefan Keller

Stefan Keller studied Business Administration and has been working for more than 25 years with PCB technology. He has gained a thorough practical experience through various functions in production planning and engineering. In 2003, he moved into product management at Würth Electronics, where he has successfully contributed to the expansion of HDI technology.

He is a sought-after partner in all of Europe when it comes to design recommendations and other matters relating to the circuit board. Since 2010, he has been the product manager of the Würth Elektronik Focus Technologies Team that deals with HDI, signal integrity, thermal management and wire bonding.

You are also interested in getting knowledge about electronic and electromechanical components? Find our webinars on this topic here.