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IC manufacturers Intel

IC manufacturers (83)

Intel 5CSXFC6D6F31C6N

Cyclone V Device

Overview

TopologyBoost Converter
Switching frequency800 kHz
IC revision2012.12.28

Description

The Cyclone® V devices are designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and cost-sensitive applications. Enhanced with integrated transceivers and hard memory controllers, the Cyclone V devices are suitable for applications in the industrial, wireless and wireline, military, and automotive markets.

Features

  • TSMC's 28-nm low-power (28LP) process technology
  • 1.1 V core voltage
  • Wirebond low-halogen packages
  • Multiple device densities with compatible package footprints for seamless migrationbetween different device densities
  • RoHS-compliant optionsEnhanced 8-input ALM with four registers
  • M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
  • Memory logic array block (MLAB)—640-bit distributed LUTRAM where you canuse up to 25% of the ALMs as MLAB memory
  • Native support for up to three signal processing precision levels(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the samevariable-precision DSP block
  • 64-bit accumulator and cascade
  • Embedded internal coefficient memory
  • Preadder/subtractor for improved efficiencyDDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC supportPCI Express® (PCIe®) Gen2 and Gen1 (x1, x2, or x4) hard IP withmultifunction support, endpoint, and root port
  • Up to 550 MHz global clock network
  • Global, quadrant, and peripheral clock networks
  • Clock networks that are not used can be powered down to reduce dynamic power
  • Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
  • Integer mode and fractional mode
  • 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
  • 400 MHz/800 Mbps external memory interface
  • On-chip termination (OCT)
  • 3.3 V support with up to 16 mA drive strength
  • 614 Mbps to 5.0 Gbps integrated transceiver speed
  • Transmit pre-emphasis and receiver equalization
  • Dynamic partial reconfiguration of individual channels
  • Single or dual-core ARM Cortex-A9 MPCore processor-up to 800 MHz maximumfrequency with support for symmetric and asymmetric multiprocessing
  • Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller,NANDflash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART,controller area network (CAN), serial peripheral interface (SPI), I2C interface, andup to 85 HPS GPIO interfaces
  • System peripherals—general-purpose timers, watchdog timers, direct memory access(DMA) controller, FPGA configuration manager, and clock and reset managers
  • On-chip RAM and boot ROM
  • HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweightHPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves inthe HPS, and vice versa
  • FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface tothe multiport front end (MPFE) of the HPS SDRAM controller
  • ARM CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
  • Tamper protection—comprehensive design protection to protect your valuable IPinvestments
  • Enhanced advanced encryption standard (AES) design security features
  • CvP
  • Partial and dynamic reconfiguration of the FPGA
  • Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP)x8 and x16 configuration options

Products

Order Code Data­sheet Simu­lation Downloads Product seriesL
(µH)
ISAT
(A)
RDC typ.
(Ω)
VT
(V (AC))
Materialfres
(MHz)
VersionLR
(µH)
RDC
(mΩ)
PolesH
(mm)
Operation Force
(g)
Actuator ColorZ @ 100 MHz
(Ω)
Zmax
(Ω)
Test Condition ZmaxIR 2
(mA)
RDC max.
(mΩ)
TypeData ratePoENumber of PortsTabHPLEOperating TemperatureLEDMountShield TabsPinsGenderPitch
(mm)
L
(mm)
IR
(A)
Working Voltage
(V (AC))
Contact Resistance
(mΩ)
Tol. RPackaging Samples
744311068SPEC
9 files WE-HCI SMT Flat Wire High Current Inductor 0.68 20 Superflux 105 SMT 0.52 3.1 3.8 3.41 -40 up to +150 °C SMT 2 7 17
744311150SPEC
9 files WE-HCI SMT Flat Wire High Current Inductor 1.5 14 Superflux 72 SMT 1.12 6.6 3.8 7.26 -40 up to +150 °C SMT 2 7 11
744314650SPEC
9 files WE-HCI SMT Flat Wire High Current Inductor 6.5 6 Superflux 50 SMT 4.5 21.5 4.8 23.65 -40 up to +150 °C SMT 2 7 6
74408943100SPEC
9 files WE-SPC SMT Power Inductor 10 2.1 0.082 28 SMT 3.8 94 -40 up to +125 °C SMT 2 4.8 1.65
742792780SPEC
8 files WE-CBF SMT EMI Suppression Ferrite Bead SMT 0.5 220 360 450 MHz 900 350 Wide Band -55 up to +125 °C SMT 1 0.3
742792609SPEC
8 files WE-CBF SMT EMI Suppression Ferrite Bead SMT 0.8 30 40 1000 MHz 3000 40 High Current -55 up to +125 °C SMT 1.6 2
7499011121ASPEC
6 files WE-RJ45 LAN Transformer 1500 THT 14 10/100 Base-T non-PoE 1 Down No -40 up to +85 °C yellow-green THT Yes 22
416131160804SPEC
6 files WS-DISV Small Compact SMT Flat Actuator with Top Tape 1.27 mm 4 500 White -40 up to +85 °C 4 1.27 6.25 Tape and Reel
434121043816SPEC
5 files WS-TASV SMT Tact Switch 6.0x3.5 mm 4.3 160 Black -40 up to +85 °C 0.05 Tape and Reel
61800925023SPEC
6 files WR-DSUB Male PCB Connector Standard Straight -40 up to +85 °C 9 Male 30.81 3 125 30 max. Tray
62501421621SPEC
6 files WR-BHD 2.00 mm Male Box Header Straight -40 up to +125 °C THT 14 Male 2 21.2 2 250 20 max. Tray
693071010811SPEC
6 files WR-CRD Micro SD Card Connector Push & Push 8 pins Push & Push -25 up to +85 °C SMT 8 Socket 0.5 100 100 max. Tape and Reel & Mylar
Samples
Order Code Data­sheet Simu­lation Downloads Product seriesL
(µH)
ISAT
(A)
RDC typ.
(Ω)
VT
(V (AC))
Materialfres
(MHz)
VersionLR
(µH)
RDC
(mΩ)
PolesH
(mm)
Operation Force
(g)
Actuator ColorZ @ 100 MHz
(Ω)
Zmax
(Ω)
Test Condition ZmaxIR 2
(mA)
RDC max.
(mΩ)
TypeData ratePoENumber of PortsTabHPLEOperating TemperatureLEDMountShield TabsPinsGenderPitch
(mm)
L
(mm)
IR
(A)
Working Voltage
(V (AC))
Contact Resistance
(mΩ)
Tol. RPackaging Samples